See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
Multiphysics Modeling Results for the High Flux Isotope Reactor to Support its LEU Conversion
Ongoing engineering design studies at Oak Ridge National Laboratory are exploring the feasibility of converting the High Flux Isotope Reactor (HFIR) from highly enriched uranium (HEU) to low-enriched uranium (LEU) fuel. HFIR is a pressurized light water-cooled and moderated research ... Read More
Analysis of Contact Stiffness in Hammer to Anvil Collision for Pyroshock Purposes
When dealing with space and aerospace equipment, their ability to withstand the strong excitations produced during the launch must be tested by the manufacturers according to international standards requirements. In fact, structural subsystems of the rockets are commonly released by ... Read More
Analysis of the Stress and Load Distribution of an Assembled Screw Including Threaded Contact
There are different possibilities to simulate a bolted joint. If only the connection of parts in an assembly with the stress distribution and surface pressure between the components without the bolt itself is of interest, the thread of the bolt is omitted and only the effect of bolted ... Read More
Dynamic Characterization of Elastomeric Rings
Elastomeric elements are currently used as external dampers in many applications to increase the stability of dynamical systems, e.g., rotor-bearings systems. However, the dynamic design of systems embedded with elastomeric dampers is a hard task, since the properties of this kind of ... Read More
Fully Automated FE-Application
The new FE Toolbox from Lauterbach Verfahrenstechnik GmbH combines precision and user-friendliness in one application. Our tool is tailor-made to reliably achieve a fast and accurate design of various components in pressure vessel design and plant design. With COMSOL Multiphysics we have ... Read More
Investigation of the Crystalline Lens Inertial Overshooting: Ex Vivo and Simulation Results
For the purpose of investigation the inertial behaviour of the crystalline lens, the COMSOL Multiphysics® software was used to create a 2D multi-physics model of the porcine eye globe, by using the Fluid-Structure Interaction (FSI). The geometry of the porcine eye model was adapted from ... Read More
Prediction of Douglas-Fir Sawn Timber Strength based on X-ray Computed Tomography and FEA
Due to climate change impacts and the worsening growth conditions of Norway spruce (Picea abies) the species composition of European forests is being diversified, incorporating more hardwoods as well as drought-resistant softwood species, such as Douglas-fir (Pseudotsuga menziesii). As a ... Read More
Predictive Simulations of Warpage Phenomena on Arbitrarily Patterned Silicon Wafers
In this simulation, we aim to comprehend the origin and mechanism of the warpage phenomenon in patterned silicon wafers, which are key components in the field of microelectronics. This issue can become more pronounced in the presence of high global density of the patterns and can lead to ... Read More
Two-Scale Modeling Of The WAAM Process: Link Between Thermo-Hydrodynamics And Mechanics
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors and at different scales. The study at the melt pool scale is often interesting to study deposition shapes and defects but not very relevant to calculate the stresses and strains at ... Read More
Wire Bonding: A Thorough Numerical Methodology
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... Read More