Electrodeposition Blog Posts
Optimizing the Electroplating Process for Multiple Components
From everyday kitchen utensils to iconic award show statuettes, rack plating is a useful manufacturing process that ensures components are electroplated both uniformly and efficiently.
The Art and Science of Electrochemical Plating
Electrochemical plating, a surface finishing technique used in the automotive, electronics, corrosion protection, aerospace, and defense industries, is both an art and a science. Let us explain.
Modeling Copper Electrodeposition on a Circuit Board
Copper electrodeposition is used to manufacture PCBs. Here, we discuss modeling the electrodeposition of copper in the trench of a PCB.
How to Model Electrochemical Resistance and Capacitance
Resistive and capacitive effects are fundamental to the understanding of electrochemical systems. The resistances and capacitances due to mass transfer can be represented through physical equations describing the corresponding fundamental phenomena, like diffusion. Further, when considering the resistive or capacitive behavior of double layers, thin films, and reaction kinetics, such effects can be treated simply through physical conditions relating electrochemical currents and voltages. Lastly, resistances and capacitances from external loading circuits can easily be represented in the COMSOL Multiphysics® software.
Modeling Current Distributions in a Molten Salt Electro-Refiner
Today, we welcome a new guest blogger, Alexandre Oury of SIMTEC. He discusses the analysis of current distributions in a molten salt electro-refiner. In a webinar highlighting electrochemical recycling processes, SIMTEC presented a computational approach for predicting current distributions in a molten salt electro-refiner. The three main types of current distribution (primary, secondary, and tertiary) were treated, with a particular emphasis on the first two types. Using COMSOL Multiphysics, we implemented primary and secondary current distributions in an electrolysis cell.
Electroplating Simulations for Printed Circuit Board Designers
The printed circuit board (PCB) is the heart of almost any electronic product, carrying the components and copper wires supporting its functionality. The manufacture often involves electroplating, a process that can vary between designs. This leaves you, the engineer behind its simulation and optimization, constantly creating new models. What if you could push much of this work onto the designers, engineers, and technicians behind its design and manufacture, having them run their own electroplating simulations for PCBs? See how here.
Electroplating: How the U.S. Mint Makes a Penny
What’s a penny made of? Though they appear to be solid copper coins, they actually don’t contain much copper at all these days. Instead, the U.S. Mint saves money by applying only a veneer of valuable metal onto a less expensive one. Have you ever thought about the manufacturing process by which this is achieved? Let’s find out.
Which Current Distribution Interface Do I Use?
When designing electrochemical cells, we consider the three classes of current distribution in the electrolyte and electrodes: primary, secondary, and tertiary. We recently introduced the essential theory of current distribution. Here, we illustrate the different current distributions with a wire electrode example to help you choose between the current distribution interfaces in COMSOL Multiphysics for your electrochemical cell simulation.
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