Apr 4, 2019 Washington, District of Columbia8:30 AM - 4:00 PM

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Join us for COMSOL Day Washington, D.C., to participate in panel discussions, experience product demonstrations, and exchange ideas with other simulation specialists. This event on April 4 will exemplify many use cases from industry and government organizations. You will also be able to meet with others in the field of simulation and multiphysics modeling as well as chat with COMSOL technical and sales staff. Feel free to invite your colleagues.

Schedule

8:00 a.m.
Registration
8:30 a.m.
Welcoming Remarks
8:45 a.m.
Parallel Sessions
Introduction to COMSOL Multiphysics® Presentation/Demo

This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will cover all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and postprocessing.

New Features in COMSOL® Presentation/Demo

Come to this session to hear about the new features in COMSOL Multiphysics® version 5.4 and to learn how they can be incorporated into your existing multiphysics models.

9:45 a.m.
Coffee Break
10:00 a.m.
Parallel Sessions
Electromagnetic Heating

Learn how to model electromagnetic heating for low- and high-frequency electromagnetics applications. Important electromagnetic heating phenomena covered include Joule heating, induction heating, RF heating, and laser heating.

CFD

Get an overview of how to use the CFD Module, an add-on product to the COMSOL Multiphysics® software.

11:00 a.m.
Coffee Break
11:15

Find out how COMSOL is revolutionizing computational modeling with the Application Builder, COMSOL Server™, and COMSOL Compiler™. These tools allow you to quickly and easily deploy customized, standalone solutions that match your specific simulation needs.

12:00 p.m.
Break for Lunch
1:00 p.m.
Parallel Sessions
Multiphysics in Electromagnetics Panel Discussion

Combining electromagnetics simulations with the effects of heat transfer, structural mechanics, and fluid flow is important to get a competitive advantage in designing next generation electromagnetic and electronics components. In this session, a panel of users from industry and COMSOL will share their experiences working with modeling and simulation, as well as answer technical questions related to the use of COMSOL Multiphysics®.

Moderated by: Aline Tomasian, COMSOL, Inc.

Acoustics-Structure Interactions Presentation/Demo

Learn about the Acoustics Module and how it can be used to model sounds waves, their propagation, and their interaction with solids at both small and large scales. Use cases include nondestructive testing, speakers, microphones, and sonar.

1:45 p.m.
Coffee Break
2:00 p.m.
Parallel Sessions
Transducers in Acoustics and MEMS Panel Discussion

The design requirements on transducers within acoustics and MEMS applications are continuously more challenging to meet. Whether for smart devices or high-power SONAR applications, the need for simulation is as great as ever. In this session, a panel of users from industry and COMSOL will share their experiences working with modeling and simulation and answer technical questions related to the use of the COMSOL Multiphysics® software.

Moderated by: Kyle Koppenhoefer, AltaSim Technologies

Low-Frequency Electromagnetics Presentation/Demo

The AC/DC Module is used for modeling Maxwell's equations in the low-frequency regime. Find out how this tool applies to the modeling of resistive and capacitive devices, inductors and coils, as well as motors and magnets.

2:45 p.m.
Coffee Break
3:00 p.m.
Q&A and Meet Your COMSOL Engineer

COMSOL Day Details

Location

Embassy Suites Hotel by Hilton at the Chevy Chase Pavilion
4300 Military Road N.W.
Washington, District of Columbia 20015
Directions

Friendship Heights Station is directly underneath the hotel; available self-parking garage.

COMSOL Speakers

Gilbert Kiyingi
COMSOL, Inc.
Gilbert Kiyingi joined COMSOL in 2015 and currently works as a technical sales engineer, covering accounts in DC, Maryland, Virginia, and Delaware. He received a BS in aerospace engineering from Boston University.
Jeanette Littmarck
COMSOL, Inc.
Jeanette Littmarck has 25 years of sales experience at COMSOL and is the sales director for government accounts in Washington, D.C.; Maryland; Alabama; and Virginia. She joined COMSOL AB in Sweden in 1992 and became the first sales representative for all Scandinavian customers before moving to the Burlington office in 2000.
Aline Tomasian
COMSOL, Inc.
Aline Tomasian is an applications engineer at COMSOL, specializing in high- and low-frequency electromagnetics. She holds a BS in physics from Worcester Polytechnic Institute.
Temesgen Kindo
COMSOL, Inc.
Temesgen Kindo works at COMSOL as an applications engineer, specializing in structural mechanics and equation-based modeling. Before joining the Burlington, MA office, Temesgen received his PhD in civil engineering from Duke University. He is interested in nonlinear mechanics, multiphysics problems, and applied mathematics.
Siva Sashank Tholeti
COMSOL, Inc.
Siva Sashank Tholeti is an applications engineer at COMSOL. He received his PhD in aeronautics and astronautics from Purdue University. His areas of interest include CFD, plasma-enhanced aerodynamics, plasma physics, propulsion, and multiphysics problems.
Jinlan Huang
COMSOL, Inc.
Jinlan Huang is an applications engineer for vibrations and acoustics and instructs acoustics and heat transfer training courses. She received her PhD from Boston University, Department of Aerospace and Mechanical Engineering, investigating acoustic wave propagation in complex-tissue environments and ultrasound-induced tissue heating and bleeding control. She joined COMSOL in 2011.
Samuel Hocker
NASA Langley Research Center
Dr. Samuel Hocker is a structural materials engineer at NASA Langley Research Center. Dr. Hocker has been using the COMSOL Multiphysics® software to optimize the design of an axial-flux permanent magnet motor for maximum power density.
Lauren Lagua
Northrop Grumman Corporation (NGC)
Lauren Lagua is an acoustics engineer for Northrop Grumman Corporation (NGC) in their Undersea Systems Division. She received her MS from the University of Maryland, Department of Mechanical Engineering, with a focus on nonlinear, viscoelastic material analysis. At NGC, her role focuses on sonar transducer design, manufacturing, and acoustic testing.
Naresh Das
U.S. Army Research Laboratory (ARL)
Dr. Naresh Das is a physicist at the U.S. Army Research Laboratory (ARL), Adelphi, MD. His specializations are in field of semiconductor device physics and technology. Recently, he started using the COMSOL Multiphysics® software to model plasmonic particle interaction to improve semiconductor device performance. Prior to joining ARL, he worked at NASA's Goddard Space Flight Center and at the Air Force Research Laboratory in Albuquerque, NM.
Kyle Koppenhoefer
AltaSim Technologies
Kyle Koppenhoefer has been one of the principals and leaders at AltaSim Technologies for 15 years. He works with customers to identify how computational analysis can be used to further develop their products and manufacturing processes. Prior to cofounding AltaSim, Kyle worked for the Department of Defense and the Edison Welding Institute. He holds a PhD in civil engineering from the University of Illinois.
Jin Liu
Carrier Corporation
Jin Liu is an acoustical engineer for the Tec RD&E Strategy/Prog. Office at Carrier Corporation. She received a PhD in acoustics from Penn State University. Her specializations are in thermoacoustics, porous materials' viscous and heat transfer behaviors under oscillating flow, wave propagation, and acoustics-structure interaction for noise control.

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