In collaboration with CSEM, we cordially invite you to join us for COMSOL Microsystems Day for an introduction to the COMSOL Multiphysics® software 's capabilities and to explore modeling of mechanics, fluidics, electrodynamics, optics and heat transfer for microsystem sensors and actuators.
You will also see how to turn your model into a simplified app with the Application Builder, so that your collaborators, colleagues, and customers can run their own simulation analyses using the COMSOL® software.
Anyone, who would like to start working with COMSOL Multiphysics®, is welcome to join this free-of-charge event.
All attendees will receive a two-week evaluation of the software.
The seating is limited, please register and reserve your seat in advance.
For additional information, please email firstname.lastname@example.org.
- Modeling MEMS sensors and actuators based on smart materials for a wide range of applications, including vibration, active shape control, structural health monitoring, and energy harvesting
- Electric circuit functionality in the COMSOL Multiphysics® software
- How electric circuit models can be coupled to finite element models within the context of MEMS analysis
Large angle flexure pivot development for high accuracy positioning of optical payloads
In this study, an innovative design of a Large Angle Flexure Pivot (LAFP) is proposed. It combines the advantages of flexure mechanisms - no friction, no backlash, no need for lubricant, no wear - while surpassing one of their few flaws, small displacement strokes. These are usually comprised between 10° and 20° for flexible angular pivots. The LAFP proposed here can reach a deflection of +/- 90° for three millions full stroke cycles. If the stroke is limited to +/- 70°, infinite operational lifetime is obtained. The LAFP is 120 mm in diameter, 60 mm in length and weighs less than 500 g. It can carry a payload of 1.8 kg and offers a low rotational stiffness while ensuring high lateral and transversal stiffnesses. It can operate in a temperature ranging from -140 °C to +65 °C. Its center shifts laterally less than 30 microns when rotating up to its full rotation angle. The LAFP is aimed to be mounted by pairs, coaxially. In this configuration it offers an axial displacement of less than one micron. The intended application of the LAFP is to angularly guide an optical component in a space environment.
A Multiphysic approach to determine the natural frequencies, mode shapes and quality factor of an immersed piezoelectric MEMS cantilever used for a multi-parameters gas sensor.
A resonant MEMS cantilever for viscosity, density and humidity measurements of gas was modeled. The device is based on a piezoelectric transduction integrated on top of each cantilever to enable actuation and detection of devices. The core sensing element is a rectangular vibrating plate fixed at one end and free at the other. The piezoelectric transduction of the resonating MEMS cantilevers can be achieved by integrating the piezoelectric layer sandwiched between 2 metal electrodes, in contact with the vibrating structure. Measuring the characteristics of the resonant system (resonant frequency, Q factor) allows evaluation of viscosity, density and humidity of the gases. The overall result is a calibrated predictive COMSOL model that enables to vary parameters of various origins (material, process, geometry) and perform in multiphysics studies (solid mechanics, electrostatics, thermoviscous acoustics). This opens the path to further design optimization and studies related to design for manufacturability taken into account fabrication process tolerances.
- Single-phase flow capabilities, including Newtonian and non-Newtonian flow
- Two-phase flow simulations capturing surface tension and capillary action
- Chemical species transport through diffusion, convection, and migration in electric fields
- Overview of electrohydrodynamic effects, including electroosmosis, electrophoresis, and dielectrophoresis
- Applications such as lab-on-a-chip (LOC) devices, digital microfluidics, and inkjets
- Applications in resonant cavity analysis, antenna modeling, transmission lines and waveguides, periodic structures, and scattering
- Coupling electromagnetic wave simulations to heat transfer, such as in RF heating
- Ray tracing approach in optically large systems, high-fidelity structural-thermal-optical performance (STOP) analysis within a single simulation environment
Heat Dissipation of implantable Brain-Computer Interfaces
Implantable Brain-Computer Interfaces are capable of reading electrical signals from the brain motor cortex with sufficient spatial and temporal resolution to enable reliable control of external devices such as speech synthesizers and robotic prosthesis that restore speech and movement in persons affected by spinal cord injuries or neurodegenerative diseases such as Amyotrophic Lateral Sclerosis (ALS). One of the major challenges of implantable BCIs is dissipating the heat generated inside the titanium can by electronic components and electromagnetic fields generated during wireless power transfer and data communication. To mitigate these risks, COMSOL Multiphysics has been employed to establish safe limits of heat dissipation in head tissues to meet technical standards such as ISO 14708-1:2014 that requires that no external surface of Active Implantable Medical Devices rise more than 2°C above body temperature of 37°C.
Wafer-Scale Fiber-to-Chip Coupling Solution Using Folded Micro-Optical Q-Lens and Integrated Grating Couplers
Integrated photonics circuits (PIC) profit from the increase in system integration and the substantial enhanced intensity by reducing the optical mode volume. This is especially useful, not only for nonlinear effects and sensing but also for telecommunication, space, and quantum applications. A common challenge between all the photonic chips, however, is the ability to couple light in and out of the chip by an optical fiber. Optical fibers are excellent choices for data transport over long distances, but could also be used to interconnect different parts of an optical system; e.g., lasers, detectors. Currently, the available technologies for input/output coupling are all based on chip-scale approaches and involve precise alignment of optical fibers to a “grating pattern” or to a “tapered waveguide” at the edge of a photonic chip. This “serial process” has to be repeated sequentially for every chip and leads to significant increase in the packaging cost of the final product. Having a wafer-level solution for fiber-to-chip coupling could be a game changer for the photonics industry by reducing the cost and complexity of packaging. In this talk, we will present COMSOL® simulations and a physical demonstration of a novel, wafer-scale solution developed at CSEM, where micro-optical Q-lenses are used to reflect and focus the light coming from an in-plane mounted optical fiber to a grating coupler.
- How you can benefit from the Application Builder, COMSOL Compiler™, and COMSOL Server™
- How to build an application in minutes
- How to make your applications available to others with COMSOL Server™ and COMSOL Compiler™
- Building and distributing your applications with assistance from a COMSOL engineer
COMSOL Microsystems Day Details
The parking possibilities in the vicinity are very limited, it is recommend using public transport
TrueDyne Sensors AG
Wyss Center for Bio and Neuroengineering
COMSOL Multiphysics GmbH
COMSOL Multiphysics GmbH
COMSOL Multiphysics GmbH
COMSOL Multiphysics GmbH