COMSOL Microsystems Day at CSEM

Nov 19, 2019 Neuchâtel, 9:00 AM - 5:00 PM

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In collaboration with CSEM, we cordially invite you to join us for COMSOL Microsystems Day for an introduction to the COMSOL Multiphysics® software 's capabilities and to explore modeling of mechanics, fluidics, electrodynamics, optics and heat transfer for microsystem sensors and actuators.

You will also see how to turn your model into a simplified app with the Application Builder, so that your collaborators, colleagues, and customers can run their own simulation analyses using the COMSOL® software.

The presentations and materials are in English, personal assistance in English, French, German and Italian.

Anyone, who would like to start working with COMSOL Multiphysics®, is welcome to join this free-of-charge event.

All attendees will receive a two-week evaluation of the software.

The seating is limited, please register and reserve your seat in advance.

For additional information, please email


Registration Opens
Welcome Remarks
  • Modeling MEMS sensors and actuators based on smart materials for a wide range of applications, including vibration, active shape control, structural health monitoring, and energy harvesting
  • Electric circuit functionality in the COMSOL Multiphysics® software
  • How electric circuit models can be coupled to finite element models within the context of MEMS analysis
Coffee Break
Success Stories

Large angle flexure pivot development for high accuracy positioning of optical payloads

In this study, an innovative design of a Large Angle Flexure Pivot (LAFP) is proposed. It combines the advantages of flexure mechanisms - no friction, no backlash, no need for lubricant, no wear - while surpassing one of their few flaws, small displacement strokes. These are usually comprised between 10° and 20° for flexible angular pivots. The LAFP proposed here can reach a deflection of +/- 90° for three millions full stroke cycles. If the stroke is limited to +/- 70°, infinite operational lifetime is obtained. The LAFP is 120 mm in diameter, 60 mm in length and weighs less than 500 g. It can carry a payload of 1.8 kg and offers a low rotational stiffness while ensuring high lateral and transversal stiffnesses. It can operate in a temperature ranging from -140 °C to +65 °C. Its center shifts laterally less than 30 microns when rotating up to its full rotation angle. The LAFP is aimed to be mounted by pairs, coaxially. In this configuration it offers an axial displacement of less than one micron. The intended application of the LAFP is to angularly guide an optical component in a space environment.

A Multiphysic approach to determine the natural frequencies, mode shapes and quality factor of an immersed piezoelectric MEMS cantilever used for a multi-parameters gas sensor.

A resonant MEMS cantilever for viscosity, density and humidity measurements of gas was modeled. The device is based on a piezoelectric transduction integrated on top of each cantilever to enable actuation and detection of devices. The core sensing element is a rectangular vibrating plate fixed at one end and free at the other. The piezoelectric transduction of the resonating MEMS cantilevers can be achieved by integrating the piezoelectric layer sandwiched between 2 metal electrodes, in contact with the vibrating structure. Measuring the characteristics of the resonant system (resonant frequency, Q factor) allows evaluation of viscosity, density and humidity of the gases. The overall result is a calibrated predictive COMSOL model that enables to vary parameters of various origins (material, process, geometry) and perform in multiphysics studies (solid mechanics, electrostatics, thermoviscous acoustics). This opens the path to further design optimization and studies related to design for manufacturability taken into account fabrication process tolerances.

  • Single-phase flow capabilities, including Newtonian and non-Newtonian flow
  • Two-phase flow simulations capturing surface tension and capillary action
  • Chemical species transport through diffusion, convection, and migration in electric fields
  • Overview of electrohydrodynamic effects, including electroosmosis, electrophoresis, and dielectrophoresis
  • Applications such as lab-on-a-chip (LOC) devices, digital microfluidics, and inkjets
Break for Lunch
  • Applications in resonant cavity analysis, antenna modeling, transmission lines and waveguides, periodic structures, and scattering
  • Coupling electromagnetic wave simulations to heat transfer, such as in RF heating
  • Ray tracing approach in optically large systems, high-fidelity structural-thermal-optical performance (STOP) analysis within a single simulation environment
Success Stories

Heat Dissipation of implantable Brain-Computer Interfaces

Implantable Brain-Computer Interfaces are capable of reading electrical signals from the brain motor cortex with sufficient spatial and temporal resolution to enable reliable control of external devices such as speech synthesizers and robotic prosthesis that restore speech and movement in persons affected by spinal cord injuries or neurodegenerative diseases such as Amyotrophic Lateral Sclerosis (ALS). One of the major challenges of implantable BCIs is dissipating the heat generated inside the titanium can by electronic components and electromagnetic fields generated during wireless power transfer and data communication. To mitigate these risks, COMSOL Multiphysics has been employed to establish safe limits of heat dissipation in head tissues to meet technical standards such as ISO 14708-1:2014 that requires that no external surface of Active Implantable Medical Devices rise more than 2°C above body temperature of 37°C.

Wafer-Scale Fiber-to-Chip Coupling Solution Using Folded Micro-Optical Q-Lens and Integrated Grating Couplers

Integrated photonics circuits (PIC) profit from the increase in system integration and the substantial enhanced intensity by reducing the optical mode volume. This is especially useful, not only for nonlinear effects and sensing but also for telecommunication, space, and quantum applications. A common challenge between all the photonic chips, however, is the ability to couple light in and out of the chip by an optical fiber. Optical fibers are excellent choices for data transport over long distances, but could also be used to interconnect different parts of an optical system; e.g., lasers, detectors. Currently, the available technologies for input/output coupling are all based on chip-scale approaches and involve precise alignment of optical fibers to a “grating pattern” or to a “tapered waveguide” at the edge of a photonic chip. This “serial process” has to be repeated sequentially for every chip and leads to significant increase in the packaging cost of the final product. Having a wafer-level solution for fiber-to-chip coupling could be a game changer for the photonics industry by reducing the cost and complexity of packaging. In this talk, we will present COMSOL® simulations and a physical demonstration of a novel, wafer-scale solution developed at CSEM, where micro-optical Q-lenses are used to reflect and focus the light coming from an in-plane mounted optical fiber to a grating coupler.

Coffee Break
  • How you can benefit from the Application Builder, COMSOL Compiler™, and COMSOL Server™
  • How to build an application in minutes
  • How to make your applications available to others with COMSOL Server™ and COMSOL Compiler™
  • Building and distributing your applications with assistance from a COMSOL engineer

Register for COMSOL Microsystems Day at CSEM

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Meeting Details


CSEM Headquarters
Salle Musicienne Rue Jaquet-Droz 1
Neuchâtel 2002

The parking possibilities in the vicinity are very limited, it is recommend using public transport


Florent Cosandier
Florent Cosandier grew up in Switzerland. He obtained his degree in engineering from the EPFL in 2007, after completing his studies with a master thesis in Hong Kong. In 2013, he obtained his PhD at the EPFL, for which he was awarded the Prix Omega scientific. He then joined METAS for a postdoc to develop precision mechanisms for the Swiss kibble balance. In 2014, he joined the CSEM to develop flexure mechanisms for watchmaking, aerospace, and metrology as an expert.
Alexandre Mehdaoui
TrueDyne Sensors AG
Alexandre Mehdaoui is a project manager for MEMS at TrueDyne Sensors AG, a company of the Endress+ Hauser group. Alexandre has more than 10 years of relevant experience in MEMS design, modeling, and fabrication process development. Prior to his current position at TrueDyne, Alexandre worked in MEMS sensor development at Bürkert, a fluid control systems company; Coventor Paris, a MEMS and semiconductor EDA software company; and GlobalFoundries Singapore, a semiconductor foundry. He holds a PhD in nanotechnology and MEMS engineering from EPFL (Lausanne, Switzerland), as well as a master’s degree in physics from the National Institute of Applied Sciences (INSA-France).
Jorge M Herrera-Morales
Wyss Center for Bio and Neuroengineering
Jorge received his engineering degree in materials science from the University of Kyushu, Japan, in 2010. He also has a double international master's degree in functional advanced materials from the University of Augsburg (Germany) and the Grenoble Institute of Technology (France), as well as a PhD from the University Grenoble Alps in bioengineering. He joined the Wyss Center in 2016, where he is responsible for the technological development of implantable device packaging and testing.
Amir Hossein Ghadimi
Amir H. Ghadimi is currently a postdoctoral research scientist at CSEM. He obtained his PhD in electrical engineering in 2018 from the EPFL. His research activities are focused on integrated photonics circuits for optical precision sensing applications, nonlinear optics and optical COMB spectroscopy, optical telecommunications, and quantum information processing. His work has been highlighted by several high-impact publications such as _Science_ (2018), _Nature_ (2015), and _PRX_ (2016). He is the recipient of several prestigious scientific awards such as the 2019 Swiss Physical Society (SPS) award for exceptional research by a young physicist, 2018 Swiss nanotechnology best PhD thesis award, and 2018 best paper award at European Frequency and Time Forum.
Sven Friedel
COMSOL Multiphysics GmbH
Sven Friedel established the COMSOL branch office in Switzerland in 2004. He received his PhD in physics from the University of Leipzig in the field of inverse electromagnetic problems. There, he also taught lectures in geomagnetism and volcanology before joining the Institute of Geotechnical Engineering at ETH Zürich as a postdoctoral researcher.
Thierry Luthy
COMSOL Multiphysics GmbH
Thierry Luthy joined COMSOL in 2006 and currently works as a technical sales manager. He studied physics at the University of Neuchâtel. After his diploma, he worked at the EMPA Dübendorf for two years. Thierry received his PhD in the field of composite materials from the ETH Zürich.
Fabio Greco
COMSOL Multiphysics GmbH
Fabio Greco joined the Swiss COMSOL office in 2018 as a technical sales and applications engineer. His background is in mechanical engineering, with an MSc from the Polytechnic of Turin and a PhD from the Swiss Federal Institute of Technology Lausanne (EPFL) in the field of structural mechanics for high-temperature energy conversion.
Zoran Vidakovic
COMSOL Multiphysics GmbH
Zoran Vidakovic joined the Swiss COMSOL office in 2010. He received his MS degree in mechanical engineering from ETH Zürich. At the Laboratory for Energy Conversion, he specialized in turbomachinery, heat transfer, and fluid dynamics. His industrial internship was completed in the R&D department of MAN Diesel & Turbo Schweiz AG.
Andrea Radu
COMSOL Multiphysics GmbH
Andrea Radu is an applications manager at the Swiss COMSOL office. She's previously worked at ETH Zürich on porous media transport. Andrea is a chemical engineer with an MS in food science from Université Blaise Pascal, Clermont-Ferrand and a PhD from TU Delft in the field of membrane processes for water treatment.