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Thermal Initial Stresses in a Layered Plate

Application ID: 273


The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial stress and the temperature is finally reduced to 20 degrees C.

This application was built using the following:

MEMS Module Structural Mechanics Module

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product\'s capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.