Technical Papers and Presentations

As the light output of the LED is strongly dependent on the thermal performance, thermal interface material (TIM) has become an area of interest that can be used to sink more heat out to the ambient.

In COMSOL Multiphysics, physics interfaces like joule heating, heat transfer in solid and laminar flow are used to simulate the thermal dissipation with the specific material properties and thickness of synthesized TIM. Based on the model, an interactive web app is built using the Application Builder.

The thickness of the TIM is studied and varied in the simulation app with the maximum of 100 micron. The maximum temperature is obtained and compared with different simulated variables, ranging from 88.58°C to 92.93°C at 0.5A. Furthermore, the velocity, current and heat distribution are studied in order to optimize the TIM performance of the whole package. This studies shows the importance of the thickness of the TIM and applied heat power to the geometry created based on the specific material used in the simulation. The heat distribution of the whole downlight is important to be identified via simulation as it will improve the development of the prototype.