See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
A Consistent Environment for the Numerical Prediction of the Properties of Composite Materials
The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on ... Read More
A Study of Curved Flexures for MEMS
Large deflection actuators are becoming increasingly important for microsystems. Since actuation forces are usually small, large deflection actuators usually require flexures with low stiffness. Rectangular serpentine flexures are often used for such actuators due to their low stiffness ... Read More
High Coupling Factor Piezoelectric Materials for Bending Actuators: Analytical and Finite Elements Modeling Results
New giant piezoelectric factor materials such as PMN-PT and PZN-PT were researched during the last decade and are actually becoming commercially available. As they seem very attractive for actuator designs, we studied their potential in replacing PZT ceramics. In a first comparative ... Read More
Mobility of Catalytic Self-Propelled Nanorods Modeling with COMSOL Multiphysics®
A small particle or a nano-sized object placed in a liquid is subject to random collisions with solvent molecules. The resulting erratic movement of the object is known as Brownian motion, which, in nature, cannot be used to any practical advantage both in natural systems (such as ... Read More
Motion of Uncharged Particles in Electroosmotic Flow through a Wavy Cylindrical Channel
A finite element model is employed to describe the electric potential distribution and electroosmotic flow field inside a wavy cylindrical channel. The model uses coupled Laplace and Poisson-Boltzmann to evaluate the electric potential distribution inside the channel. It also contains ... Read More
Numerical Investigation of Electroosmotic Flow in Convergent Divergent Micronozzle
A fundamental understanding of the transport phenomena in microfluidic channels is critical for systematic design and precise control of such miniaturized devices towards the integration and automation of Lab-on- a-chip devices. Electroosmotic flow is widely used to transport and mix ... Read More
FEM Study on Contactless Excitation of Acoustic Waves in SAWDevices
In this paper a finite element method(FEM) study of a surface acoustic wave (SAW)device excited by electrostatic coupling method is performed by using COMSOL Multiphysics. We have modeled a Rayleigh wave type SAW device by choosing YZ Lithium niobate as the substrate. The effect of ... Read More
Phasefield Modeling of Ferroelectric Materials
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More
Oxidation of Metallic Nanoparticles
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More
Simulation of Daisy Chain Flip-Chip Interconnections
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More