Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

The Application of micro-and nano-electromechanics on Biomedicine by COMSOL Multiphysics

J-S. Chang
National Taiwan University, Taipei, Taiwan

Prof. Jeng-Shian Chang received his B.Ec. degree (1974) in Mechanical Engineering from National Taiwan University, Taipei, Taiwan, and M.Sc. degree (1981) in Mechanical Engineering and M.Sc. degree (1983) in Computer Science both from Syracuse University, USA. In 1984 he received the Ph.D. degree in Mechanica Engineering from Syracuse University, USA. In 1984, he joined the Institute of Applied ...

Control of Technological and Production Processes Modeled by COMSOL Multiphysics as Distributed Parameter Systems

G. Hulkó, C. Belavý, G. Takács, and P. Zajíček
Slovak Technical University in Bratislava, Bratislava, Slovakia

COMSOL Multiphysics is widely utilized in the modeling of dynamics of technological and manufacturing processes. At the same time the investigated technological and manufacturing processes are generally described by systems of partial differential equations as distributed parameter systems. This paper presents actual possibilities of control of systems modeled by COMSOL Multiphysics as ...

Prism Coupling of Light in Optical Waveguides

J.T. Andrews, R.R. Kumar, and P.K. Sen
Department of Applied Physics, S G S Institute Technology & Science, Indore, Maharashtra, India

We report the results of simulation showing light coupling in waveguides through prism coupling method. Prism coupling method of light coupling in waveguides is a dominant method adopted by photonic device fabricators. It is necessary to understand the effect various parameters on light coupling in such processes. We used industry standard PDE solver COMSOL Multiphysics to study and analyze the ...

Finite Element Analysis of Multilayer Transmission Lines for High-Speed Digital Interconnects

S.M. Musa, and M.N.O. Sadiku
Prairie View A&M University, Prairie View, TX, USA

In this paper, we consider the finite element modeling of multilayer transmission lines for high-speed digital interconnects. Using COMSOL we mainly focused on the modeling of the transmission structures with both cases of symmetric and asymmetric geometries. We specifically designed asymmetric coupled microstrips and four-line symmetric coupled microstrips with a two-layer substrate. We ...

Hydro-Mechanical Modelling of a Shaft Seal in a Deep Geological Repository

D. Priyanto
Atomic Energy of Canada Limited, Pinawa, MB, Canada

The hydro-mechanical (HM) numerical simulation of a shaft seal installed at a fracture zone in a hypothetical host rock using COMSOL is presented. Two different stages are considered in the numerical modelling. Stage 1 simulates the groundwater flow into an open shaft. Stage 2 simulates the groundwater flow after installation of shaft sealing-components. The shaft sealing components include: ...

Advanced simulation in medicine and biology: Opportunities for multiphysics modeling

S. Conrad
Louisiana State University, Health Sciences Center, Shreveport, LA, USA

Steven Conrad received his MD degree from Louisiana State University in 1978, and his PhD degree in Biomedical Engineering from Case Western Reserve University in 1985. His clinical practice includes intensive care and emergency medicine, and his research interests include computational dynamics and bioinformatics. He has worked with dynamic models of gas transport in artificial lungs, and more ...

Acoustic streaming flows in discharge lighting

T. Dreeben
Osram Sylvania, Beverly, MA, USA

Thomas Dreeben received his B.A. in Philosophy and Mathematics in 1985, and his Ph.D. in Mechanical Engineering in 1997, both from Cornell University. He has worked in automotive fuel systems at Ford Motor Company, and in turbulence at Sandia National Laboratories. He currently works in lighting research at OSRAM SYLVANIA, where his modeling focuses on fluid mechanics and heat transfer as they ...

Microwave Heating at the Grain Level

S. Lefeuvre[1], and O. Gomonova[2]
[1]Eurl Creawave, Toulouse, France
[2]Siberian State Aerospace University, Krasnoyarsk, Russia

The microwave heating and processing of heterogeneous material is usually simulated using a set of coupled PDE equations in an homogeneous medium. Nowadays it is possible to describe more accurately the process with a suitable description of the heterogeneities that is at the grain level. Many authors work with spheres (circles) to represent the grains but it is difficult to achieve an ...

Long Term Performance Of Borehole Heat Exchanger Fields With Groundwater Movement

S. Lazzari, A. Priarone, and E. Zanchini
DIENCA, University of Bologna, Bologna, Italy

A numerical investigation of the long-term performance of double U-tube borehole heat exchanger (BHE) fields, in the case of non-negligible effects of groundwater movement, is performed by means of COMSOL Multiphysics. Two time periodic heat loads, with a period of one year, are studied: Q1, with a partial compensation between winter heating (principal load) and summer cooling; Q2, with no ...

Coupling of Wired PCB With Microwave Radiation – 3D Simulation and Experimental Valuation

T. D. Bui[1], F. Bremerkamp[2], and M. Nowottnick[2]
[1]Department of Automobile Engineering, Thanh Do University, Ha Noi, Vietnam
[2]Institute of Electronic Appliances and Circuits, Department “Reliability and Safety of Electronic Systems”, University of Rostock, Rostock, Germany

Modern electronic assemblies and printed circuit boards (PCB) with their sensitive structures and elements have to be protected against environmental influences by conformal coating or casting compounds. In this case the main challenge is the simultaneous curing of the polymers and the safekeeping of the electronic elements and structures on the PCB. This implies the investigation of the heating ...

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