School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
Chemistry Department, United States Naval Academy, Annapolis, MD, USA
Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...
R. Coker, J. Knox, K. Kittredge
NASA - Marshall Space Flight Center, Huntsville, AL, USA
All spacecraft systems must be minimized with respect to mass, power, and volume. Here, we focus on current efforts to improve system efficiency and reliability for water separation systems to be used on crewed vehicles. These development efforts combine sub-scale systems testing and multi-physics simulations to evaluate candidate approaches. The best performing options will then be ...
S. Arslan, J. Brown
Lawrence Technological University, Southfield, MI, USA
The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...