See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
Influence of a Refurbishing on an Old Residential Building’s Wall in Paris in Summer: Mass and Heat Transfer Approach
The implementation of thermal insulation in old residential building walls could compromise the hygrothermal behavior of the construction, especially in summer time when it is placed inside. A bad installation of insulation could have consequences on the quality of indoor air conditions ... Read More
Numerical Modeling of the Original and Advanced TEMKIN Reactor for Catalysis Experiments in Laboratory Scale
Many industrial, especially heterogeneously catalysed, processes are characterised by a strong interaction between the reaction kinetics and transport phenomena. Because experiments in laboratory scale can be very time- and cost-intensive, Temkin andKul’kova developed a new reactor ... Read More
Performance Evaluation of the 19th Century Clipper Ship Cutty Sark: A Comparative Study
The Cutty Sark, built in 1869 in Dumbarton, is the last intact composite tea clipper ship [1]. One of the last tea clippers built she took part in the tea races back from China. These races caught the public imagination of the day and were widely reported in newspapers [2]. They ... Read More
From Music to Non-Invasive Therapies via COMSOL Multiphysics® Models
Vibration and music therapies are non-invasive treatments having effective results although their basics are still disputed. By the application of COMSOL Multiphysics® software for modeling and analysis, some of the nonlinear physical phenomena laying on these applications may be ... Read More
Can we use Aquifers to Monitor Magma Chambers? Using COMSOL Multiphysics® to Investigate Subsurface Strain Changes and Their Effect on Hydrological Systems
Groundwater-bearing geological layers respond to and modify the surface expressions of magmatic activity, and they can also become agents of volcanic unrest themselves. Interpretations of unrest signals as groundwater responses to changes in the magmatic system can be found for many ... Read More
Numerical Simulation of Evaporation Processes in Electron Beam Welding
In this paper describes an original method for indirect measurement of the vapor pressure and temperature in the keyhole in electron beam welding. This method is based on the determination of the concentration of chemical elements in the vapor above the welding zone. Taking into account ... Read More
Prediction of Air Permeability Using a Finite Element Method
Air permeability is one of the most important parameters in the study of thermo-physiological comfort of fabrics. The main goal of this work is to develop a virtual process that allows the prediction of air permeability of any fabric without realizing a sample. The Free and Porous Media ... Read More
Numerical Simulations of a Subsonic/Supersonic Coaxial Jet for an Efficient Design of Experimental Setup
The flow field of a coaxial jet with the internal (primary) flow being subsonic and the external (secondary) flow being supersonic has been investigated with COMSOL Multiphysics® software. We used the results to correct defects in the nozzle geometry and we evaluated the effect of heat ... Read More
Electrical Scale-Up of Metallurgical Processes
The problem under investigation is electrical scale-up of a generic metallurgical process for primary metal production through resistive heating of slag by electric current, typically supplied by an AC three-phase system. Maxwell’s equations are analyzed revealing that the properties of ... Read More
Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... Read More